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FUJITSU SEMICONDUCTOR DATA SHEET
DS04-28026-2E
ASSP Image Control
RGB Encoder
MB3516A
s DESCRIPTION
The MB3516A is an RGB encoder containing an RGB signal matrix circuit, balanced modulator circuits, and a luminance signal/color-difference signal mixing circuit. This device inputs analog RGB and composite sync signals and outputs a composite video signal in the NTSC or PAL format. Also, it has Y/C separate output pins and RGB signal output pins.
s FEATURES
* * * * * * * * * Supporting for both of the NTSC and PAL formats Containing Y/C separate output and RGB output pins as well as a composite video signal output pin On-chip 75 driver (Composite video output, Y/C separate outputs, RGB outputs) Half H-killer circuit integrated Burst flag generator integrated PAL alternate circuit integrated Built-in filters Operation with a +5 volt single power supply Low power consumption: 280 mW (typical)
s PACKAGE
24-pin plastic SOP
(FPT-24P-M01)
MB3516A
s PIN ASSIGNMENT
(TOP VIEW)
GND1 R-IN G-IN B-IN N.C. fSC -IN NTSC/PAL-IN N.C. N.C. CSYNC-IN N.C. VCC1
1 2 3 4 5 6 7 8 9 10 11 12
24 23 22 21 20 19 18 17 16 15 14 13
GND2 R-OUT G-OUT B-OUT VIDEO-OUT VCC2 N.C. Y-TRAP Y-OUT CROMA-OUT N.C. N.C.
(FPT-24P-M01)
2
MB3516A
s PIN DESCRIPTION
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Symbol GND 1 R-IN G-IN B-IN N.C. fsc-IN NTSC/PAL-IN N.C. N.C. CSYNC-IN N.C. VCC1 N.C. N.C. CROMA-OUT Y-OUT I/O Pin name Function Ground pin for circuits other than 75 output driver With CSYNC-IN at the "L" level, the R-IN, G-IN, and B-IN pins are clamped. During the "L" level period, the R-IN, G-IN, and B-IN pins input pedestal levels. (100% = 1 Vp-p) GND l pin I Analog RGB input pins
Unused pin I I
Subcarrier input pin Inputs a sine wave of 1.0 to 5.0 Vp-p or a pulse carrier. NTSC/PAL selector pin "H" level : Selects the NTSC mode. "L" level : Selects the PAL mode.
CSYNC-IN = "L" level : Outputs a composite sync signal while clamping R-IN, G-IN, and B-IN.
Unused pin Unused pin I Composite sync signal input pin
Unused pin Power-supply pin Unused pin Unused pin O Chroma signal output pin
Power-supply pin for circuits other than 75 output driver. Capable of directly driving a 75 load. Capable of directly driving a 75 load. Capable of adjusting the frequency characteristic of the luminance signal at the composite video signal output pin by connecting a capacitor or a capacitor and an inductor in series to GND1. Power-supply pin for the 75 output driver circuit Capable of directly driving a 75 load. Capable of directly driving a 75 load. Ground pin for 75 output driver circuit
O Y-signal output pin Luminance signal band control pin Unused pin Power-supply pin O Composite video signal output pin Analog RGB signal output pins
17
Y-TRAP
18 19 20 21 22 23 24
N.C. VCC2 VIDEO-OUT B-OUT G-OUT R-OUT GND2
O
GND2 pin
3
4
B-OUT 21 20 19 18 17 16 15 14 13 VIDEO-OUT VCC2 N.C. Y-TRAP Y-OUT CROMA-OUT N.C. N.C.
GND2
R-OUT
G-OUT
MB3516A
s BLOCK DIAGRAM
24
23
22
R output buffer 75 drive
G output buffer 75 drive
B output buffer 75 drive
VIDEO output buffer 75 drive
Y output buffer 75 drive CROMA output buffer 75 drive
Y/C MIX
buffer
Y
R-Y LPF
R-Y modulation B-Y modulation
M a t r i x
B-Y LPF CSYNC CSYNC
CSYNC
Clamp Clamp
LPF
Clamp
Phase generation
Burst generation & NTSC/PAL selection
1 B-IN N.C.
2
3
4
5
6 fSC-IN
7 NTSC/PAL-IN
8 N.C.
9 N.C.
10 CSYNC-IN
11 N.C.
12 VCC1
GND1
R-IN
G-IN
MB3516A
s ABSOLUTE MAXIMUM RATINGS
Parameter Power supply voltage Digital signal input voltage Subcarrier input voltage Storage temperature Symbol VCC VID Vfsc Tstg Rating Min. 0 0 -55 Max. 7 VCC VCC +125 Unit V V V C
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
s RECOMMENDED OPERATING CONDITIONS
Parameter Power supply voltage Subcarrier input voltage RGB input voltage Digital "L" level input voltage Digital "H" level input voltage Operating temperature Symbol VCC Vfsc VR, G, B VIL VIH Ta Value Min. 4.75 1.0 0 2.0 -20 Typ. 5.00 Max. 5.25 5.0 1.0 0.8 +75 Unit V VP-P VP-P V V C
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device's electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their FUJITSU representatives beforehand.
5
MB3516A
s ELECTRICAL CHARACTERISTICS
(VCC1, 2 = 5 V, Ta = 25C) Parameter Symbol VO-R RGB output voltage VO-G VO-B Sync signal level Y-signal level at R 100% Y-signal level at G 100% Y-signal level at B 100% VOY (CS) VOY (R) VOY (G) VOY (B) Conditions R-IN = 1 VP-P G-IN = 1 VP-P B-IN = 1 VP-P Y-OUT Y-OUT Y-OUT Y-OUT Y-OUT VIDEO-OUT VIDEO-OUT VIDEO-OUT VIDEO-OUT VIDEO-OUT CROMA-OUT VIDEO-OUT CROMA-OUT, VIDEO-OUT CROMA-OUT, VIDEO-OUT CROMA-OUT, VIDEO-OUT CROMA-OUT, VIDEO-OUT CROMA-OUT, VIDEO-OUT CROMA-OUT, VIDEO-OUT CROMA-OUT, VIDEO-OUT CROMA-OUT, VIDEO-OUT CROMA-OUT, VIDEO-OUT CROMA-OUT, VIDEO-OUT CROMA-OUT, VIDEO-OUT CROMA-OUT, VIDEO-OUT 0.48 0.365 0.714 0.136 1.21 0.48 0.365 0.714 0.136 1.21 0.45 0.45 2.84 94 2.65 231 2.01 337 0.9 125 215 8 0.4 0 0.57 0.43 0.84 0.16 1.43 0.57 0.43 0.84 0.16 1.43 0.57 0.57 3.16 104 2.95 241 2.24 347 1.0 135 225 10 0.5 40 16 0.66 0.495 0.966 0.184 1.65 0.66 0.495 0.966 0.184 1.65 0.69 0.69 3.48 114 3.25 251 2.47 357 1.1 145 235 12 0.7 40 58 23 VP-P V V V V VP-P V V V V VP-P VP-P deg deg deg deg deg Count s mVP-P mA mA 1.28 1.43 1.58 VP-P Value Min. Typ. Max. Unit
Y-signal level at White 100% VOY (W) Sync signal level Y-signal level at R 100% Y-signal level at G 100% Y-signal level at B 100% VOV-Y (CS) VOV-Y (R) VOV-Y (G) VOV-Y (B)
Y-signal level at White 100% VOV-Y (W) Burst level R chroma ratio R phase G chroma ratio G phase B chroma ratio B phase PAL burst level ratio PAL burst phase Burst count Burst position Carrier leak Current consumption 1 Current consumption 2 VOC (BT) VOV-C (BT) R/BT R G/BT G B/BT B K (BT) PAL /PAL NBT td-BT VL ICC 1 ICC 2
6
MB3516A
s VIDEO SIGNAL WAVEFORMS AND MAJOR MEASUREMENT ITEMS
CSYNC-IN
TTL level
R-IN
1.0 Vp-p
G-IN
1.0 Vp-p
B-IN
1.0 Vp-p
VOY(B)
Y-OUT
VOY(W) VOY(G) VOY(R) VOY(CS)
VOC(B)
VL
CROMA-OUT
VOC(BT) VOC(G)
VOC(R)
VOV-Y(W) VOV-C(R)
VL
VIDEO-OUT
VOV-C(BT)
VOV-C(G) VOV-Y(CS) VOV-C(B)
7
MB3516A
s ELECTRICAL CHARACTERISTIC MEASUREMENT CIRCUIT DIAGRAM
MB3516A 1 GND1 0.1 F 2 SG1 3 G-IN 0.1 F 4 SG3 5 B-IN B-OUT 150 VIDEO -OUT 20 470 F 150 6 SG4 7 SG5 8 Y-TRAP 9 Y-OUT 150 10 SG6 11 CSYNC -IN CROMA -OUT 14 15 470 F CROMA-OUT 150 16 470 F Y-OUT NTSC/PAL -IN 17 fSC-IN VCC2 18 19 VIDEO -OUT G-OUT 150 21 470 F B-OUT R-IN R-OUT 150 0.1F SG2 22 470 F G-OUT GND2 23 470 F R-OUT 24
12 VCC1
13
VCC = 5 V
8
MB3516A
s BURST SIGNAL
The MB3516A generates a burst signal at the timings shown below based on the composite sync signal. * Horizontal synchronization
CSYNC-IN
(TTL level)
td-BT
NBT
VIDEO-OUT
Burst signal
CROMA-OUT
td-BT
NBT
* Vertical synchronization
Color field I
CSYNC-IN
Color field II
Color field I
VIDEO-OUT
Color field II Burst signal Sync signal
9
MB3516A
s EQUIVALENT CIRCUIT DIAGRAMS
* R-IN, G-IN, B-IN
VCC1
* fSC-IN
VCC1
50 pF 4 k 48 k
GND1
GND1
* NTSC/PAL-IN, CSYNC-IN
VCC1
* Y-TRAP
VCC1
15 k
8.5 k
12 k GND1 GND1
1.5 k
0.5 pF
* CROMA-OUT, VIDEO-OUT, Y-OUT, B-OUT, G-OUT, R-OUT
VCC2
GND2
10
MB3516A
s USAGE PRECAUTIONS
1. Analog RGB signal input
The analog RGB signal must be input with 1.0 Vp-p or lower at a sufficiently low impedance.
2. Subcarrier input
The subcarrier input to the MB3516A supports both of a sine wave from 1.0 to 5.0 Vp-p and a pulse.
3. Board pattern design
The noise limiting capacitors to be inserted to the Vcc1 and Vcc2 pins must be connected to the GND1 and GND2 pins as closely to the pins as possible. The patterns to be connected to the GND1 and GND2 pins must be as wide as possible to reduce parasitic impedance.
s ORDERING INFORMATION
Part number MB3516APF Package 24-pin plastic SOP (FPT-24P-M01) Remarks
11
MB3516A
s PACKAGE DIMENSION
24-pin plastic SOP (FPT-24P-M01)
15.24 -0.20 .600 -.008
+0.25 +.010
2.25(.089)MAX (Mounting height) 0.05(.002)MIN (STAND OFF)
INDEX
5.300.30 (.209.012)
7.800.40 (.307.016)
6.80 -0.20 .268 -.008
+0.40 +.016
1.27(.050) TYP
0.450.10 (.018.004)
O0.13(.005)
M
0.15 -0.02 .006 -.001 Details of "A" part
+0.05 +.002
0.500.20 (.020.008)
0.20(.008)
"A" 0.10(.004) 13.97(.550)REF
0.50(.020) 0.18(.007)MAX 0.68(.027)MAX
Dimensions in mm (inches)
C
1994 FUJITSU LIMITED F24007S-3C-4
12
MB3516A
FUJITSU LIMITED
For further information please contact:
Japan FUJITSU LIMITED Corporate Global Business Support Division Electronic Devices KAWASAKI PLANT, 4-1-1, Kamikodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa 211-8588, Japan Tel: +81-44-754-3763 Fax: +81-44-754-3329
All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. The information and circuit diagrams in this document are presented as examples of semiconductor device applications, and are not intended to be incorporated in devices for actual use. Also, FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of this information or circuit diagrams. The contents of this document may not be reproduced or copied without the permission of FUJITSU LIMITED. FUJITSU semiconductor devices are intended for use in standard applications (computers, office automation and other office equipments, industrial, communications, and measurement equipments, personal or household devices, etc.). CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation may directly affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult with FUJITSU sales representatives before such use. The company will not be responsible for damages arising from such use without prior approval. Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Control Law of Japan, the prior authorization by Japanese government should be required for export of those products from Japan.
http://www.fujitsu.co.jp/
North and South America FUJITSU MICROELECTRONICS, INC. 3545 North First Street, San Jose, CA 95134-1804, USA Tel: +1-408-922-9000 Fax: +1-408-922-9179 Customer Response Center Mon. - Fri.: 7 am - 5 pm (PST) Tel: +1-800-866-8608 Fax: +1-408-922-9179
http://www.fujitsumicro.com/
Europe FUJITSU MICROELECTRONICS EUROPE GmbH Am Siebenstein 6-10, D-63303 Dreieich-Buchschlag, Germany Tel: +49-6103-690-0 Fax: +49-6103-690-122
http://www.fujitsu-fme.com/
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http://www.fmap.com.sg/
F0003 (c) FUJITSU LIMITED Printed in Japan

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